IEC 60191-6-4-2003 半导体器件的机械标准化.第6-4部分:绘制表面安装半导体器件封装外形图的一般规则.焊球网格陈列封装尺寸的测量方法图绘制的一般规则.球状网格阵列(BGA)封装尺寸的测量方法

作者:标准资料网 时间:2024-05-29 08:59:45   浏览:9216   来源:标准资料网
下载地址: 点击此处下载
【英文标准名称】:Mechanicalstandardizationofsemiconductordevices-Part6-4:Generalrulesforthepreparationofoutlinedrawingsofsurfacemountedsemiconductordevicepackages;Measuringmethodsforpackagedimensionsofballgridarray(BGA)
【原文标准名称】:半导体器件的机械标准化.第6-4部分:绘制表面安装半导体器件封装外形图的一般规则.焊球网格陈列封装尺寸的测量方法图绘制的一般规则.球状网格阵列(BGA)封装尺寸的测量方法
【标准号】:IEC60191-6-4-2003
【标准状态】:现行
【国别】:国际
【发布日期】:2003-06
【实施或试行日期】:
【发布单位】:国际电工委员会(IX-IEC)
【起草单位】:IEC/SC47D
【标准类型】:()
【标准水平】:()
【中文主题词】:电子设备及元件;电气外壳;半导体;表面安装;外壳;表面安装设备;测量方法;半导体封装;外形图;焊球网格阵列;半导体器件;工程图;电子工程;电气工程;设计;集成电路;作标记;图纸;尺寸
【英文主题词】:BallGridArray;Casedrawing;Definitions;Design;Dimensions;Drawings;Electricenclosures;Electricalengineering;Electronicengineering;Electronicequipmentandcomponents;Enclosures;Engineeringdrawings;Integratedcircuits;Marking;Measurement;Measuringtechniques;Mechanic;Methodsformeasuring;Semiconductordevices;Semiconductorpackage;Semiconductors;SMD;Standardization;Surfacemounting;Types
【摘要】:Coverstherequirementsforthemeasuringmethodsofballgridarray(BGA)dimensions.
【中国标准分类号】:L40
【国际标准分类号】:01_100_25;31_240
【页数】:22P.;A4
【正文语种】:英语


下载地址: 点击此处下载
Product Code:SAE J2073
Title:Automotive Starter Remanufacturing Procedures (NONCURRENT Jun 2008)
Issuing Committee:Service Committee
Scope:These manufacturing procedures are recommended minimum guidelines for use by remanufacturers of light-duty automotive starters to promote consistent reliability, durability, and safety of remanufactured starters. Installation of remanufactured or rebuilt products is often an economical way to repair a vehicle even though the products may not be identical to original equipment parts. Before processing any part, a remanufacturer should determine if the original design and present condition of the core are suitable for remanufacturing so as to provide durable operation of the part as well as acceptable performance when installed on the vehicle. The remanufacturer should also consider the safety aspects of the product and any recommendations of the original manufacturers related to remanufacturing or rebuilding their product.While these PROCEDURES are meant to be universal in application, various product types have unique features of dimension and design which may require special remanufacturing processes and tests that are either not covered by or are exceptions to these PROCEDURES.